Business of Ishii Tool & Engineering Corp.

Combining electronics,mechanical and precision machining technologies,we deliver superior total engineering solutions.

Pioneer of technology development for the Semiconductor Back End operation

PROCESS OF SEMICONDUCTOR ASSEMBLY and IKK PRODUCTS
　
Front End Wafer Process
↓
Back End Dicing
↓
Die Bonding
↓
Wire Bonding
↓
Molding IKK PRODUCTS
↓
Trim&Forming
↓
Marking
↓
Inspection
↓
Products

Mechanical Engineering Field

Flexibility to customers' requirements
One of the advantageous haracteristics of our semiconductor equipment is modularization of each component such as forming press and marking system so that the system can be flexibly adaptable to the change of production process.

Electronics Engineering

Leading-edge products enabled by our aggressive technology development

Electronics engineering plays a very important role in the control of the equipment, our product. In order to keep abreast of the most advanced technology reflected to our product, our company designs and manufature microcomputers all in house.

Precision Machine Tooling

Continuous effort for sub-micron accuracy

High pin count move of semiconductor devices (IC) requires the associated trim and form die to be as precise as the order of 1 micron or even sub micron. Ishii Tool & Engineering Corporation, equipped with excellent technology in precision machine tooling, is manufacturing and providing high quality precision dies.